A PEEK-based 3D printable filament was brought to market by Evonik (US office in Parsippany, NJ). The high-temperature and chemical-resistant ready-to-use material is particularly suitable for the additive manufacturing of sophisticated industrial plastic parts and is designed for processing in common extrusion-based 3D printing technologies such as Fused Filament Fabrication (FFF) or Fused Deposition Modeling (FDM).
The new Infinam PEEK 9359 F is a natural colored PEEK filament with a diameter of 1.75 mm, which is wound on 500 g spools, which is for direct use in standard FFF / FDM 3D printers for PEEK materials are suitable. Due to its unique properties such as high mechanical strength, hydrolysis resistance or inherent flame retardancy, it is said to be particularly suitable for the production of light and high-performance 3D parts for the aerospace, automotive and oil and gas industries.
Compared to stainless steel, 3D parts made from Infinam 9359 F are about 80% lighter and 30% tougher and have excellent fatigue resistance. This combination of properties, says Evonik, makes this new filament the preferred high-performance material as a metal replacement for demanding lightweight construction applications. The Infinam 9359 F is also characterized by excellent wear resistance and low sliding friction and is therefore ideally suited for the production of light components.
The 3D components printed from this filament are reported to be able to withstand long-term temperature effects of 250 ° C or short-term temperature effects of over 30 ° C.
Sylvia Monsheimer, Head of Additive Manufacturing and New 3D Technologies at Evonik, said: “After the commercial success of the PEEK filament for medical technology, we are now expanding the product range to include an industrial material quality. We are constantly using our innovative strength in polymer chemistry to create new ones Develop filaments, powders or photopolymers and bring them to market in order to diversify the material landscape and thus enable new, infinite 3D applications. “